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 Praetorian(R) L-C LCD and Camera EMI Filter Array with ESD Protection CM2006
Features
* * * *
Includes ESD protection, level-shifting, buffering and sync impedance matching VESA VSIS Version 1 Revision 2 compatible interface Supports optional NAVI signalling requirements 7 channels of ESD protection for all VGA port connector pins. All pins meet IEC-61000-4-2 Level 4 ESD requirements (8kV contact discharge) Very low loading capacitance from ESD protection diodes on VIDEO lines (3pF maximum) Schmitt-triggered input buffers for HSYNC and VSYNC lines Bidirectional level shifting N-channel FETs provided for DDC_CLK and DDC_DATA channels Backdrive protection on all lines Compact 16-lead QSOP package RoHS-compliant, lead-free finishing
Product Description
The CM2006 connects between the VGA or DVI-I port connector and the internal analog or digital flat panel controller logic. The CM2006 incorporates ESD protection for all signals, level shifting for the DDC signals and buffering for the SYNC signals. ESD protection for the video, DDC and SYNC lines is implemented with low-capacitance current steering diodes. All connector interface pins are designed to safely handle the high current spikes specified by IEC-610004-2 Level 4 (8kV contact discharge). The ESD protection for the DDC, SYNC and VIDEO signal pins is designed to prevent "backdrive current" when the device is powered down while connected to a video source that is powered up. Separate positive supply rails are provided for the VIDEO / SYNC signals and DDC signals to facilitate interfacing with low voltage video controller ICs and microcontrollers to provide design flexibility in multisupply-voltage environments. Two Schmitt-triggered non-inverting buffers redrive and condition the HSYNC and VSYNC signals from the video connector (SYNC1, SYNC2). These buffers accept VESA VSIS compliant TTL input signals and convert them to CMOS output levels that swing between ground and VCC. Two N-channel MOSFETs provide the level shifting function required when the DDC controller or EDID EEPROM is operated at a lower supply voltage than the monitor. The gate terminals for these MOSFETS (VCC_DDC) should be connected to the supply rail (typically 3.3V, 2.5V etc.) that supplies power to the transceivers of the DDC controller. The CM1693 is housed in space saving, low profile, 0.40mm pitch uDFN packages in a RoHS compliant, lead-free format.
* * * * * *
Applications
VGA and DVI-I ports in: * Monitors * TVs
(c)2010 SCILLC. All rights reserved. May 2010 - Rev. 2
Publication Order Number: CM2006/D
CM2006
Electrical Schematic
VCC_DDC
BYP
8
VCC
1 10 11
7
DDC_OUT1 DDC_OUT2
VIDEO_1 VIDEO_2 VIDEO_3 GND
3 4 5 6 16 9 12 2 13 15 14
RT RT
GND
SYNC_OUT2 SYNC_OUT1
DDC_IN1 DDC_IN2 ENABLE SYNC_IN1 SYNC_IN2
Rev. 2 | Page 2 of 9 | www.onsemi.com
CM2006
PIN DESCRIPTIONS
LEAD(s) 1 NAME VCC ENABLE VIDEO_1 DESCRIPTION This is a supply input for the SYNC_1 and SYNC_2 level shifters, video protection and the DDC circuits. Active high enable. Disables the Sync buffer outputs when low. Video signal ESD protection channel. This pin is typically tied one of the video lines between the controller device and the video connector. Video signal ESD protection channel. This pin is typically tied one of the video lines between the controller device and the video connector. Video signal ESD protection channel. This pin is typically tied one of the video lines between the controller device and the video connector. Ground reference supply pin. This is an isolated supply input for the DDC_1 and DDC_2 level-shifting N-FET gates. An external 0.22uF bypass capacitor is required on this pin. DDC signal input. Connects to the video connector side of one of the DDC lines.signal output. DDC signal output. Connects to the monitor DDC logic. DDC signal output. Connects to the monitor DDC logic. DDC signal input. Connects to the video connector side of one of the DDC lines Sync signal buffer input. Connects to the video connector side of one of the sync lines. Sync signal buffer output. Connects to the monitor SYNC logic. Sync signal buffer input. Connects to the video connector side of one of the sync lines. Sync signal buffer output. Connects to the monitor SYNC logic.
2 3
4
VIDEO_2
5
VIDEO_3
6 7 8 9 10 11 12 13 14 15 16
GND VCC_DDC BYP DDC_IN1 DDC_OUT1 DDC_OUT DDC_IN2 SYNC_IN1 SYNC_OUT1 SYNC_IN2 SYNC_OUT2
Ordering Information
PART NUMBERING INFORMATION
Pins 16
Package QSOP
Ordering Part Number CM2006-02QR
1
Part Marking CM2006-02QR
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Rev.2 | Page 3 of 9 | www.onsemi.com
CM2006
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER VCC_DDC and VCC Supply Voltage Inputs DC Voltage at Inputs VIDEO_1, VIDEO_2, VIDEO_3 DDC_IN1, DDC_IN2 DDC_OUT1, DDC_OUT2 SYNC_IN1, SYNC_IN2, ENABLE Operating Temperature Range Storage Temperature Range Package Power Rating (TA=25 C) RATING [GND - 0.5] to +6.0 UNITS V
[GND - 0.5] to [VCC + 0.5] [GND - 0.5] to 6.0 [GND - 0.5] to 6.0 [GND - 0.5] to [VCC + 0.5] -40 to +85 -40 to +150 500
V V V V C C mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range VCC RATING -40 to +85 5 UNITS C V
Rev. 2 | Page 4 of 9 | www.onsemi.com
CM2006
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL PARAMETER ICC_DDC ICC VCC_DDC Supply Current VCC Supply Current CONDITIONS VCC_DDC = 5.0V VCC = 5V; SYNC inputs at GND or VCC; SYNC outputs unloaded VCC = 5V; SYNC inputs at 3.0V; SYNC outputs unloaded VF VIH VIL VHYS VOH VOL ROUT IIN ESD Diode Forward Voltage Logic High Input Voltage Logic Low Input Voltage Hysteresis Voltage Logic High Output Voltage Logic Low Output Voltage SYNC Driver Output Resistance Input Current VIDEO Inputs SYNC_IN1, SYNC_IN2 Inputs IOFF Level Shifting N-MOSFET "OFF" State Leakage Current IF = 10mA VCC = 5.0V; Note 2 VCC = 5.0V; Note 2 VCC = 5.0V; Note 2 IOH = 0mA, VCC = 5.0V; Note 2 IOL = 0mA, VCC = 5.0V; Note 2 VCC = 5.0V; SYNC Inputs at GND or 3.0V VCC = 5.0V; VIN = VCC or GND VCC = 5.0V; VIN = VCC or GND (VCC_DDC - VDDC_IN) 0.4V; VDDC_OUT = VCC_DDC (VCC_DDC - VDDC_OUT) 0.4V; VDDC_IN = VCC_DDC 10 0.18 3 3.5 12 12 3 2 8 7 15 4.0 0.15 24 400 2.0 0.5 MIN TYP MAX UNITS 10 1 2.0 1.0 A mA mA V V V mV V V A A A A A V pF pF ns ns ns kV kV
10 10 10 10
IBACKDRIVE VON CIN_VID
Current conducted from input pins when Vcc VCC < VINPUT_PIN ; Note 5 is powered down. Voltage Drop Across Level-shifting N-MOSFET when "ON" VIDEO Input Capacitance VCC_DDC = 2.5V; VS = GND; IDS = 3mA; VCC = 5.0V; VIN = 2.5V; f = 1MHz VCC = 2.5V; VIN = 1.25V; f = 1MHz
tPLH tPHL tR, tF VESD1 VESD
SYNC Driver L => H Propagation Delay SYNC Driver H => L Propagation Delay SYNC Driver Output Rise & Fall Times
CL = 50pF; VCC = 5.0V; Input tR and tF 5ns CL = 50pF; VCC = 5.0V; Input tR and tF 5ns CL = 50pF; VCC = 5.0V; Input tR and tF 5ns
ESD Withstand Voltage, Sync_out pins only VCC = 5V; Notes 3 and 4 ESD Withstand Voltage VCC = 5V; Notes 3 and 5
Note 1: All parameters specified over standard operating conditions unless otherwise noted. Note 2: These parameters apply only to the SYNC drivers. Note that ROUT = RT + RBUFFER. Note 3: Per the IEC-61000-4-2 International ESD Standard, Level 4 contact discharge method. BYP and VCC must be bypassed to GND via a low impedance ground plane with a 0.22F, low inductance, chip ceramic capacitor at each supply pin. ESD pulse is applied between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND. Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2. All pins are ESD protected to the industry standard 2kV Human Body Model (MIL-STD-883, Method 3015). Note 4: This specification applies to the SYNC_OUT pins only. Note 5: Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2.
Rev.2 | Page 5 of 9 | www.onsemi.com
CM2006
Application Information
Figure 1. Typical Application Connection Diagram NOTES
The CM2006 should be placed as close to the VGA or DVI-I connector as possible. The ESD protection channels VIDEO_1, VIDEO_2, VIDEO_3 may be used interchangeably between the R, G, B signals. 3 If differential video signal routing is used, the RED, BLUE, and GREEN signal lines should be terminated with external 37.5 ohm resistors. 4 "VF" are external video filters for the RGB signals. 5 Supply bypass capacitors C1 and C2 must be placed immediately adjacent to the corresponding Vcc pins. Connections to the Vcc pins and ground plane must be made with minimal length copper traces (preferably less than 5mm) for best ESD protection. 6 The bypass capacitor for the BYP pin has been omitted in this diagram. This results in a reduction in the maximum ESD withstand voltage at the DDC_OUT pins from 8kV to 2kV. If 8kV ESD protection is required, a 0.22F ceramic bypass capacitor should be connected between BYP and ground. 7 The SYNC buffers may be used interchangeably between HSYNC and VSYNC. 8 The EMI filters at the SYNC_OUT and DDC_OUT pins (C5 to C12, and Ferrite Beads FB1 to FB4) are for reference only. The component values and filter configuration may be changed to suit the application. 9 The DDC level shifters DDC_IN, DDC_OUT, may be used interchangeably between DDCA_CLK and DDCA_DATA. 10 R1, R2 are optional. They may be used, if required, to pull the DDC_CLK and DDC_DATA lines to VCC_5V when no VGA card is connected to the VGA monitor. If used, it should be noted that "back current" may flow between the DDC pins and VCC_5V via these resistors when VCC_5V is powered down. 1 2
Rev. 2 | Page 6 of 9 | www.onsemi.com
CM2006
Mechanical Details
QSOP Mechanical Specifications CM2006 devices are packaged in 16-pin QSOP packages. Dimensions are presented below.
PACKAGE DIMENSIONS
Package Pins Dimensions Millimeters Min A A1 B C D E e H L # per tube # per tape and reel 1.35 0.10 0.20 0.18 4.80 3.81 Max 1.75 0.25 0.30 0.25 5.00 3.98 Min 0.053 0.004 0.008 0.007 0.189 0.150 QSOP (JEDEC name is SSOP) 16 Inches Max 0.069 0.010 0.012 0.010 0.197 0.157
0.64 BSC 5.79 0.40 6.19 1.27
0.025 BSC 0.228 0.016 0.244 0.050
100 pcs* 2500 pcs
Controlling dimension: inches
Package Dimensions for QSOP-16
* This is an approximate number which may vary.
Rev.2 | Page 7 of 9 | www.onsemi.com
CM2006
Tape and Reel Specifications
PACKAGE SIZE (mm) 4.90 X 3.89 X 1.55 POCKET SIZE (mm) B0 X A0 X K0 5.30 X 6.50 X 2.10 TAPE WIDTH W 12mm REEL DIAMETER 330mm (13") QTY PER REEL 2500
PART NUMBER CM2006
P0 4mm
P1 8mm
Rev. 2 | Page 8 of 9 | www.onsemi.com
CM2006
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
FULFILLMENT LLMENT: LITERATURE FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email orderlit@onsemi.com Technical Support: N. American Technical Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
Rev.2 | Page 9 of 9 | www.onsemi.com


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